Clarkson University Brings Expertise in Chemical-Mechanical Planarization to NY SMART I-Corridor Tech Hub
As the U.S. strives to command global semiconductor chip manufacturing, Clarkson University stands out as a pioneering research institution in chemical-mechanical planarization (CMP), a critical process in semiconductor manufacturing. Its unparalleled expertise firmly establishes Clarkson as a leader in this critical field, playing a pivotal role in addressing the global chip shortage.
Clarkson University is part of the The New York Semiconductor Manufacturing and Research Technology Innovation Corridor (NY SMART I-Corridor Tech Hub), led by CenterState CEO, a U.S. Department of Commerce Tech Hub that aims to enhance regional semiconductor manufacturing capabilities while ensuring economic opportunity for underserved communities.
Clarkson offers the Tech Hub technical expertise in CMP, which is a complex process involving multiple chemical and mechanical technologies, as well as solutions to the industry’s vital workforce needs.
“Clarkson University’s involvement in the NY SMART I-Corridor Tech Hub will continue to build on our existing expertise and long-standing relationships with corporate partners,” said Devon Shipp, Director of the The Center for Advanced Materials Processing (CAMP) at Clarkson University. “This project will further the current research and ensure that Clarkson and its corporate partners, and thus the U.S., maintain leadership in semiconductor technologies and can supply the workforce that is critical for the chip manufacturers to flourish in the U.S.”
In the initial round of funding awards from the federal government, the NY Smart I-Corridor Tech Hub received $40 million for its work in the semiconductor manufacturing field.
“This success is the result of the strong collaboration amongst our partners from across Syracuse, Buffalo, Rochester and Ithaca. Their shared vision and thoughtful leadership are the true legacy of this work. The specific component projects aim to solve the growth challenges the region would otherwise face over the coming decade and ensure that progress is translated to all members of our communities,” said Joe Stefko, President and CEO at OneROC. “ This investment puts the region in an unequivocal position to accelerate these strategies for growth, and further solidifies this corridor as a global leader of semiconductor innovation, manufacturing, workforce training and business attraction. It is a firm signal to the world that this region is primed to lead the resurgence of advanced manufacturing and semiconductor production in the U.S., which will help address the vulnerabilities in this national priority by building on our historic strengths in manufacturing and unique expertise in microelectronics, sensing and optics.”
As one of 12 Tech Hub Designees selected for implementation funding across the country, NY SMART I-Corridor Tech Hub will leverage this award to support projects that are:
- Establishing a supply chain network that expands capacity of existing and potential suppliers through scaling manufacturing support
- Closing critical gaps in upskilling, hiring, and retention of predominantly middle-skilled positions in semiconductor-specific roles through workforce development programs
- Increasing access to regional semiconductor research and development assets, which will facilitate collaboration across research institutions and stimulate innovation in semiconductor manufacturing and commercialization of new technology;
- Integrating consortium-wide strategy support throughout all components of the Tech Hub to provide management of targeted stakeholder engagement, industry engagement, equity efforts, and stewardship of discretionary impact funding.
Clarkson University is a strategic partner of many chip manufacturers and their suppliers, and is a world leader in innovative research in CMP. Chip manufacturers such as Intel, IBM, Micron, and GlobalFoundries have sought out Clarkson University researchers to provide technological advances in CMP as chip feature sizes have shrunk by 1000x over the past 30 years and to help fill their workforce needs.
The funding announcement for the Tech Hub comes just weeks before Clarkson is set to host the 26th International Symposium on Chemical-Mechanical Planarization (CMP). The symposium, which will be held from Aug. 11 to 14 in Lake Placid, serves as the leading forum to hear ideas, discuss technologies and network with colleagues in the CMP field.
“The CAMP CMP Symposium is always an exciting event given it focuses on cutting-edge research in the CMP field,” Shipp said. “It also showcases the work by graduate and undergraduate students from Clarkson and other universities, and gives them an opportunity to network with leaders at all the big chip manufacturers and their suppliers. It’s a win-win situation for the students and companies looking to hire.”
About the NY SMART I-Corridor Tech Hub
The NY SMART I-Corridor Tech Hub spans the Buffalo, Rochester, Syracuse and Ithaca region and was developed by a consortium of 100+ partners, including industry, academia, labor, nonprofit, government and other private sector members. By the end of the decade, 25% of all chips produced in the United States will be manufactured within 350 miles of this Tech Hub – with no other region in the nation accounting for a greater share of microchip production.
The NY SMART I-Corridor was selected as one of only 12 Tech Hub award winners and will bring $40 million in federal funding to the Buffalo-Rochester-Syracuse-Ithaca I-Corridor.
