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CAMP June Newsletter: Page 2

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 CAMP’s Annual Technical Meeting continued from page1


 It included representatives of Industry, University, and New York State Economic Development Organizations.  The keynote speakers were Ed Reinfurt (Director of the Division of Science, Technology, & Innovation, Empire State Development) and Bernie Anger (General Manager of Control and Communication Systems for GE Intelligent Platforms). Ed Reinfurt’s keynote address was called “The Role of CATs in the State and Nation’s Innovation Agenda for Manufacturers.”  The title of the keynote address presented by Bernie Anger was “Automation in the Age of Cloud Computing.”

This successful meeting was well attended and had many excellent poster presentations on CAMP research. The posters were judged in three categories: most attractive, most creative, and best overall. Certificates and ribbons were presented by Dr. Terry Leib (Technology Director, Chemistry and Chemical Engineering, GE Global Research) to the first, second, and third place winners of each category.  Details of the meeting will be included in CAMP’s Annual Report (September 2012) Newsletter.

 

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CAMP to Sponsor Seventeenth International Symposium on Chemical - Mechanical Planarization

CAMP will sponsor its Seventeenth International Symposium on Chemical-Mechanical Planarization during the month of August.  The three-day symposium/workshop will be held (August 12-15, 2012) at the Crowne Plaza Resort & Golf Club in Lake Placid, New York.  It will include presentations by industrial and university representatives and a poster session.  The workshop, to be held in a Gordon conference type format, will focus on several fundamental aspects of chemical-mechanical planarization including particle and colloidal aspects, polishing mechanisms, pad/conditioning behavior, flow characterization, Cu/barrier film planarization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer issues, MEMS / MOEMS, as well as STI, Nitride/Poly, etc. polishing. 

 The co-organizers of this year’s International CMP Conference are S.V. Babu (Distinguished University Professor and CAMP Director, Clarkson University), Manabu Tsujimura ( Director and CTO of Ebara Corporation in Japan), Jin-Goo Park ( Professor, Department of Materials Engineering at Hanyang University, Korea), Donald Canaperi (Senior Engineer at  IBM),  Joseph Steigerwald (Intel Fellow; Technology and Manufacturing Group and Director of Chemical Mechanical Polish Technology), Matt Prince (Principal Engineer, Intel), Lee Cook (Technology Fellow and Global Slurry R&D Director, Dow Electronic Materials), and Anurag Jindal (CMP Process Engineer, Micron).