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CAMP and CACT Hold the First Joint Spring Symposium

From left: Robert Naum (Applied Coatings, Inc.), Dr Santokh Badesha (Xerox Fellow at the Xerox Corporation), Distinguished University Professor and CAMP Director S.V. Babu, Mrs. Craig, Charles Craig (Sr. VP, Science & Technology Director – Administration and Operations, Corning Incorporated), and Barry Watkins (Associate Director of CACT at Alfred University).

The Center for Advanced Materials Processing (CAMP) at Clarkson University and the Center for Advanced Ceramic Technology (CACT) at Alfred University held their first joint Spring Symposium ever. The event took place in Fairport, NY on March 5& 6, 2012. This Symposium covered a broad range of research activities and gave industrial scientists and engineers a chance to interact with CAMP / CACT faculty on their expertise. Charles Craig (Sr. VP, Science & Technology Director – Administration and Operations, Corning Incorporated) delivered the Keynote Address titled “Innovations at Corning Shaping Our World Today … Tomorrow.” This successful meeting was both enlightening and stimulating and included presentations by university and industrial representatives.

 

CAMP’s Annual Technical Meeting

CAMP’s Annual Technical Meeting will be held May 16 - 18, 2012, at the Holiday Inn in Albany, New York. The objective of this meeting is to provide a forum for an exchange of ideas and information between university and industry researchers involved in fine particle processing and nanotechnology and related colloid and surface aspects as well as applications. This event is expected to place an emphasis on technology in batteries, semiconductors, and sustainable energy sources such as solar and wind energy. Presentations by faculty, industrial scientists and engineers will highlight this meeting, which also includes a poster session on CAMP research. The keynote speakers are Ed Reinfurt (Director of the Division of Science, Technology & Innovation, Empire State Development) and Bernie Anger (President of GE Intelligent Platforms).

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