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Clarkson University's Center for Advanced Materials Processing Sponsors 17th Annual International Symposium on Chemical-Mechanical Planarization
Researchers from several high technology companies, suppliers and universities from the United States, Japan, Korea, Germany, and Belgium gathered in Lake Placid earlier in August for the 17th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson University’s Center for Advanced Materials Processing (CAMP).
Chemical-mechanical planarization or chemical-mechanical polishing -- CMP for short -- is a process that uses nano-sized abrasives in a reactive, chemical slurry to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity (a flat and uniformly smooth surface).
CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices we use daily in our homes and businesses.
Since the wafers typically have a 300 mm diameter, this planarity extends over an eight-orders-of-magnitude length scale.
This technology plays a critical role in today’s microelectronics industry and is the ideal planarizing technology for use with the interlayer dielectrics and metal films used in all forms of logic and memory devices extending down to14 nanometer feature sizes.
This year’s event focused on several fundamental aspects of chemical-mechanical planarization including particle and colloidal aspects, polishing mechanisms, pad/conditioning behavior, flow characterization, copper/barrier film planarization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer issues, and MEMS (microelectromechanical systems), as well as STI (shallow trench isolation), Nitride/Poly (silicon nitride/polysilicon) and polishing of new channel and barrier materials like germanium, indium phosphide, ruthenium, cobalt, etc.
Distinguished University Professor S.V. Babu, the director of CAMP, served as the lead organizer of this year’s symposium, as he has for the past 16 years.
He was assisted by co-chairs Manabu Tsujimura (CTO and director of the board, Ebara Corporation, Japan), Jin-Goo Park (professor and chairman, Department of Materials Engineering, Hanyang University, Korea), Donald Canaperi (senior engineer, IBM), Joseph Steigerwald (Intel fellow, technology and manufacturing group and director of chemical mechanical polish technology), Matt Prince (principal engineer, Intel), Lee Cook (technology fellow and global slurry R&D director, Dow Electronic Materials), and Anurag Jindal (CMP process engineer, Micron).
Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results.
The symposium also included a poster session, an after-dinner keynote speaker, and a special award presentation.
Monday night’s keynote speaker, Rama Divakaruni (chief technologist, ISDA Alliance, IBM), was introduced by Clarkson Senior Vice President & Provost Chuck Thorpe. Divakaruni delivered an insightful talk, titled “Challenges for 14 nm and Beyond: Beyond Planar CMOS.”
Tuesday evening featured an award and recognition for Manabu Tsujimura (CTO and director of the board, Ebara Corporation in Japan). Clarkson President Tony Collins and Babu presented an award and certificate to Tsujimura for his excellent long-term contributions to CAMP in the area of chemical-mechanical planarization.
Clarkson University launches leaders into the global economy. One in five alumni already leads as a CEO, VP or equivalent senior executive of a company. Located just outside the Adirondack Park in Potsdam, N.Y., Clarkson is a nationally recognized research university for undergraduates with select graduate programs in signature areas of academic excellence directed toward the world’s pressing issues. Through 50 rigorous programs of study in engineering, business, arts, sciences and health sciences, the entire learning-living community spans boundaries across disciplines, nations and cultures to build powers of observation, challenge the status quo, and connect discovery and engineering innovation with enterprise.
[Photographs for media use are available at http://www.clarkson.edu/news/photos/cmp-2012.jpg & http://www.clarkson.edu/news/photos/cmp-2012-tsujimura.jpg.]
cmp-2012.jpg: Clarkson University Senior Vice President & Provost Chuck Thorpe (center) with some of the organizers of the 17th International Symposium on Chemical-Mechanical Planarization. Left to right: Donald Canaperi (senior engineer, IBM), S.V. Babu (distinguished university professor/CAMP director, Clarkson University), Thorpe, Manabu Tsujimura (CTO and director of the board, Ebara Corporation, Japan), and Jin-Goo Park (professor and chair, Department of Materials Engineering at Hanyang University, Korea).
cmp-2012- tsujimura.jpg: Clarkson University President Tony Collins and Distinguished University Professor/CAMP Director S.V. Babu present an award and certificate to Manabu Tsujimura (CTO and director of the board, Ebara Corporation in Japan) for his excellent long-term contributions to Clarkson’s Center for Advanced Materials Processing. Left to right: Collins, Tsujimura, Tsujimura’s wife Kumiko, and Babu.