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Clarkson University’s Director Of CAMP Co-Authors His Twentieth Patent
[A photograph for newspaper use is available at http://www.clarkson.edu/news/photos/babu_patent.jpg]
S.V. Babu, director of the Center for Advanced Materials Processing (CAMP) and Distinguished University Professor at Clarkson University, recently co-authored his twentieth career patent.
The patent, U.S. #6,918,820, details a method for polishing compositions comprising polymeric cores having inorganic surfaces. The process was invented by Babu and Dennis E. Smith of the Eastman Kodak Company in Rochester, N.Y., and has potential applications in chemical mechanical planarization (CMP) of metal and dielectric films of importance in the fabrication of semiconductor devices. Babu’s other patents involve the application of diamond like carbon films, low pressure plasma processing for adhesion enhancement and surface cleaning, as well as several other aspects of CMP.
“I am very pleased with this achievement since it reflects the results of continued and intellectually exciting interactions with industry,” says Babu. “It is a small milestone in my research career and brings attention to the world-class research ongoing at CAMP and Clarkson.”
CMP is a technology which has its roots in the pre-industrial era and today is the technology of choice among semiconductor chip fabricators to planarize or remove undesired topography from the surface of semiconductor chips as interconnect layers for electrical circuits are laid down. The chemical agents present in a CMP slurry modify low-lying surfaces and protect them from abrasion and the mechanical agents remove the unwanted material from the higher elevations, all at a length scale of tens of nanometers, or less. The technique outlined by Babu and Smith’s patent describes compositions and methods used for chemical-mechanical polishing (CMP), which is comparable to “wet-sanding” on a microscopic or nano level. In particular, the procedure relates specifically to CMP by which a surface is made smooth by rubbing it with particulate media consisting of particles having a core-shell structure in which a polymeric core is embedded with a shell of inorganic particles.
Clarkson’s Center for Advanced Materials Processing (CAMP) is dedicated to developing research and educational programs in high-technology materials processing, and to transferring newly developed technologies to business and industry. CAMP receives support from the New York State Office of Science, Technology, and Academic Research for research and operating expenses as one of 15 Centers for Advanced Technology (CAT). In addition, CAMP-related research receives several million dollars in funding each year from the federal government and private industry.
PHOTO CAPTION: S.V. Babu (right), director of the Center for Advanced Materials Processing (CAMP) and Distinguished University Professor at Clarkson University, has been awarded his 20th patent by the U.S. Patent Office. The patent, #6,918,820, was co-authored by Dennis Smith of Kodak and assigned to Kodak. Shown with Babu are Clarkson chemistry professor Yuzhuo Li (left) and graduate student Graham Ehret ’04.