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Clarkson's Center For Advanced Materials Processing Sponsors Workshop On Chemical-Mechanical Polishing
[A photo for newspaper use is available at http://www.clarkson.edu/news/photos/cmp98.jpg.]
Over 100 participants from the United States, Belgium, Japan and Korea and other countries converged on Lake Placid when Clarkson University’s Center for Advanced Materials Processing (CAMP) hosted their third workshop on Chemical-Mechanical Polishing (CMP). The workshop was co-chaired by CAMP Professor S.V. Babu, Dr. Ara Philipossian of Intel and Dr. James Ryan of IBM.
Polishing can be considered the smoothing of surfaces by selective removal of minute surface roughness. The addition of a chemical component to the mechanical component was the focus of the polishing presentations at this workshop. The workshop featured discussions and presentations on CMP equipment, consumables and processes, applications of CMP to microelectronics and optics and some novel systems.
Anthony Quenelle, director of industry development for the New York State Department of Economic Development, spoke about the State's effort to bring a semiconductor fabrication facility to the State, including its 12 pre-approved and pre-permitted sites.
CAMP is in the process of organizing a symposium on CMP at the April 1999 spring meeting of the Materials Research Society (MRS) in San Francisco, California.
This year, CAMP professors have been very active in presenting and publishing their results on CMP. Solicited and contributed papers were presented at the CMP meetings organized by various technical groups in Santa Clara and San Diego, California; San Antonio, Texas, and Paris, France.