Celebrates Its 20th Anniversary
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CAMP support approximately doubled from 1991-1999. During
his tenure as "Top Cat" (the Chair of the informal association
of CAT Directors), Professor Mackay led the universities'
lobbying effort in Albany to stave off cancellation of the
entire CAT program. With major support from CAMP's Corporate
Sponsors, this effort was successful. Professor Mackay also
developed and wrote the CAMP renewal proposal which resulted
in the award to Clarkson of a second decade as a New York
University Professor S.V. Babu (Current CAMP Director)
1999 Professor S.V. Babu, of Clarkson's Department of Chemical
Engineering, was hired as CAMP Director. He still holds this
leadership position. He was also the Vice Provost for Research
during 2001 - 2004 and was named a Distinguished University
Professor when he relinquished that position.
William America (Second Deputy Director of CAMP)
were also three different Deputy Directors so far. Edward
P. McNamara served as Deputy Director until 2006, at which
time he retired and became a consultant for CAMP. Dr. William
America, who had thirty-two years of industrial experience,
became the new Deputy Director for 2006. At the end of the
year, he took a job at NXP because of family health reasons.
In 2007, John (Jack) E. Prendergast was hired as CAMP's Deputy
Director. He worked for more than 39 years in a variety of
leadership positions at Ferro Corporation, a Corporate Sponsor
of CAMP. Jack was one of the key contacts for the corporation's
collaboration with CAMP.
(Jack) Prendergast (Current Deputy Director of CAMP)
Recent Major Accomplishments
CAMP has been credited with an economic impact of $200 Million
(about $28.5 per dollar of state money) on NYS companies during
2000 - 2007. Also the number of jobs created and retained
by NYS companies as a result of collaborating with CAMP during
this time period is 158.
have been 22 patents and about 30 inventions. During 2006-2007,
royalties to Clarkson were approximately $140,000 and are
expected to grow to $500K each year in 3-4 years. There are
several technology transfer success stories. They include
the following companies:
Ferro Electronic Material Systems; Penn Yan, NY
NanoDynamics; Buffalo, NY
United Materials / APEX Technologies; Buffalo, NY
Woodruff Block; Parishville, NY
Ames Goldsmith; Glens Falls, NY
won three CAT Development Awards in 2005 -2007. One was with
the Alfred CAT (Center for Advanced Ceramic Technology) and
one was with the RPI CAT (Center for Future Energy Systems).
CAMP's portion of these awards was about $2.4 million.
also received several contracts from the Army Research Office
totaling more than $7 million since 2004.
University visits Binghamton University's Center for Advanced
Microelectronics Manufacturing (CAMM), a component of the
New York State Center of Excellence in Small Scale Systems
Integration and Packaging Center (S3IP), and Endicott
is it that the Global Electronics Industry is able to continue
to meet the demands of the consumer? The answer lies in continued
investment by industry in Research and Development as well
as Continuous Improvement Programs that are put in place at
these organizations. New production methods as well as the
development of new materials continue to advance technology
and fuel the next advance in this industry.
Endicott Interconnect (EI), Endicott, NY is a company that
is working on advanced packaging technology. This novel packaging
will be required to keep new electronic products coming to
the market at the same time that they are working to reduce
the cost of packaging electronic devices. Most electronic
devices purchased today use a rigid or fixed package to house
the electronics required to produce the items purchased today.
In Endicott, NY, a consortium of institutions, including EI,
are collaborating through Binghamton University's Center for
Advanced Microelectronics Manufacturing (CAMM) to reduce the
cost of packaging for assembling electronic devices. The goal
of the research underway in this consortium is to produce
packaging that can be made fast: print packages on a low cost
flexible substrate at high rates of speed that can be rolled
up and handled by Roll to Roll processing. The packaging being
developed there will use the principles developed in the Lithograph
Substrate for Electronic Packaging at Endicott Interconnect