CAMP Annual Report: Page 7
Clarkson University’s Center for Advanced Materials Processing (CAMP) Sponsors the Fifteenth Consecutive International Symposium on Chemical-Mechanical Planarization
Co-organizers of the 15th International Symposium on Chemical –Mechanical Planarization. From left: S.V. Babu (Distinguished University Professor / CAMP Director, Clarkson University), Donald Canaperi (Senior Engineer at IBM), Manabu Tsujimura (Director and CTO of Ebara Corporation in Japan), and Jin-Goo Park (Professor, Department of Materials Engineering, Hanyang University).
A number of researchers from several high technology companies and suppliers and some Universities from the United States, Japan, Korea, China, and Germany gathered in Lake Placid during August 8 – 11 for the 15th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson’s Center for Advanced Materials Processing (CAMP).
Chemical-Mechanical Planarization or chemical-mechanical polishing, CMP for short, is a process that uses nanosized abrasives in a reactive, chemical slurry to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity. It plays a critical role in today’s microelectronics industry and is the ideal planarizing technology for use with the interlayer dielectrics and metal films used in all forms of logic and memory devices. CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices we use daily in our homes and businesses.
S.V. Babu (Distinguished University Professor/CAMP Director, Clarkson University) again served as the lead organizer of this year’s symposium and was assisted by co-chairs Manabu Tsujimura (Director and CTO of Ebara Corporation, Japan), Donald Canaperi (Senior Engineer at IBM), Joseph Steigerwald (Intel Fellow; Technology and Manufacturing Group and Director of Chemical Mechanical Polish Technology), Jihong Choi (Senior Process Development Engineer at Global Foundries), Jin-Goo Park (Professor, Department of Materials Engineering, Hanyang University, Korea) and Matt Prince (Principal Engineer, Intel).
This year’s Symposium focused on several fundamental aspects of CMP, which included abrasive particles, polishing mechanisms, pad behavior, flow characterization, defects and post-polish cleaning, low-k films and integration issues.
Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results. The Symposium also included two after-dinner keynote speakers. Monday night’s keynote speaker Geoff Akiki (Director Abu Dhabi, Site Development, Global Foundries, and a Clarkson Alum), introduced by Clarkson University President Anthony Collins, delivered an insightful talk titled “From Contract to Collaboration: Delivering a New Approach to Foundry.” Tuesday evening’s keynote speaker Dr. Michael Fury (Techcet Group, LLC), introduced by Clarkson University Provost Thomas Young, described the early history (including that at CAMP) and evolution of CMP in an entertaining talk titled “You Want to do What to my Wafer? Before CMP was Cool.” In addition, a poster session was held to display the CMP research taking place at CAMP.
As noted by Dr. Michael Fury, research on CMP began at CAMP in 1993 as a result of several white papers that addressed the challenges associated with the rapid growth in the application of CMP in the semiconductor industry. These papers were a result of the early discussions between Professors Babu, Ahmed Busnaina, Raymond Mackay, Egon Matijevic', Richard Partch, and Don Rasmussen and the then IBM technical managers and researchers Dr. Michael Fury and Dr. Frank Kaufman. In developing the CMP thrust at CAMP, this team, which was later joined by Professor Yuzhuo Li, exploited the expertise and skills of the CAMP faculty in thin film processing, fine particle synthesis, particle coatings, colloidal chemistry, surfactants, and in the removal of particles from finished surfaces. The CMP research activity was started in Professor Babu’s laboratory at CAMP using a polishing tool donated by R. Howard Strasbaugh, Inc. and test wafers donated by IBM, Burlington. These initial efforts at CAMP on CMP were assisted by Dr. David Campbell (formerly of IBM) who was with CAMP till 1997. In 1996 Professor Babu organized the first (and the following fourteen) annual International CMP Symposium. With excellent support from Ed McNamara, Bill America and Jack Prendergast, the meetings achieved a high level of excellence and international recognition. Professor Yuzhuo Li, now on leave at BASF in Germany, also played a significant and leading role in the growth of the research in this field and in organizing the symposia.
Since those early days, in addition to training many undergraduates, Clarkson graduated over 35 Ph.D. students and a similar number of M.S. students in this field, who now occupy leading technical and management roles at Intel, IBM, Micron, etc.
Novel Polymeric Materials
Professor Sitaraman Krishnan’s research group, in the Department of Chemical & Biomolecular Engineering, specializes in the synthesis of novel polymeric materials, and studying the thin film and surface properties of these materials. Current research projects in his group include organic electrolytes and polymer nanocomposites for solar cells, proton conducting polymer membranes for fuel cells, marine antifouling coatings, and polysaccharide microparticles for controlled release applications. The group works with Professor Dipankar Roy, in the Physics Department at Clarkson University, toward developing new materials for energy conversion and storage devices. The molecular architectures and intermolecular interactions in these materials are tailored for properties such as high thermal stability, low fluidity, and high ionic conductivity. In collaboration with Professor John McLaughlin, the group is interested in computational investigation of complex fluids such as ionic liquids and nanocomposites. The graduate and undergraduate student researchers working on these projects include Ms. Lin Wu, Ms. Janice Lebga, Mr. Jianping Zheng, Ms. Azar Abidnejad, Mr. Patrick Kelleher, Mr. Theodore Glave, Mr. Edward Howell, Ms. Sydney Laramie, and Mr. Joshua Franclemont.
Professors Don H. Rasmussen and Ian I. Suni are developing new methods for thin film deposition and processing for applications to solar energy. Thin film solar cells made from CdTe, CIGS and amorphous Si are currently under intensive investigation due to their lower cost relative to bulk Si solar cells. Professor Suni's research expertise includes electrochemical deposition of thin films. This method is cost competitive and easy to scale up to the large substrate areas needed for electricity generation. For example, electrodeposition is the preferred method for Cu thin film deposition onto Si wafers. Professor Rasmussen is developing new methods to enhance thin film diffusion, including anodic bonding, for post-processing thermal treatment of the active thin films to improve the film crystallinity. Anodic bonding is widely employed in semiconductor manufacturing, including MEMS devices.
With the aim of improving the survival rate of injured soldiers, a team working at Clarkson University is designing a biocomputing system that is capable of diagnosing multiple injuries upon analysis of a complex combination of various biomarkers. The goals of the present research are to design, optimize, and critically evaluate a multi-enzyme system composed of concatenated enzyme-based logic gates which are capable of performing Boolean logic operations. This system will be applied to the automated processing of biochemical/physiological information and interfaced with electronic transducers and signal-responsive drug-delivery materials or actuators. By employing multiple clinically-relevant injury/trauma biomarkers as inputs for the enzyme gates, the new biochemical logic system would provide high-fidelity diagnostics much better than conventional single biomarker sensors. Recent work of a team of students headed by Research Assistant Professor Dr. Jan Halámek resulted in the formulation of a novel approach to the biomedical logic systems. A modular system comprising six logic gates was prototyped whose outputs were multiplexed into one concise injury code that could identify 64 unique injury conditions among 4096 possible physiological scenarios.