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Patents

In this Section

Patents:
 

 Method for selective CMP of Polysilicon: Suryadevara Babu,  Anita Natarajan and Sharath Hegde, U.S. Patent 7,723,234 (May 2010)

Polishing slurries and methods for chemical mechanical polishing: Sunil Jha, Sreehari Nimmala, Suryadevara Babu, and Udaya Patri, Sharath Hegde, Youngki Hong, U. S. Patent, 7,553,430 (June 2009)

Method for one-to-one polishing of silicon nitride and silicon oxide: Suryadevara Babu and Anita Natarajan, U.S. Patent 7,629,258 (Dec. 2009)

 
Silica and silica-based slurry: S.D. Hellring. C.P. McCann, Suryadevara Babu, Yuzhuo Li, S. Narayanan, R. Auger, 7,279,119 (Oct. 2007)

Polishing slurries and methods for chemical mechanical polishing Sunil Jha, Sreehari Nimmala, Sharath Hegde, Youngki Hong, Suryadevara Babu, and Udaya Patri, U. S. Patent, 7,186, 653 (March 2007)

Chemical-mechanical polishing slurry and method: Y-S Her, R. Srinivasan; Suryadevara Babu, S. Ramarajan, US patent 7,101,800 (Sept 2006)

Slurry for chemical mechanical polishing silicon dioxide: R. Srinivasan, Suryadevara Babu, W.G. America, and Y-S. Her, U.S. Patent 7,091,164 (August 2006)

Polishing compositions comprising polymeric cores having inorganic surface particles and method of use: Dennis Smith and S.V. Babu; U.S. Patent 6,918,820 (July 2005)

Chemical-mechanical polishing slurry and method: Y-S. Her, R. Srinivasan, S.V. Babu and S. Ramarajan, U.S. patent 6,702,954 (March 2004)

Slurry for chemical mechanical polishing of silicon dioxide: R. Srinivasan, S.V. Babu, W.G. America, and Y-S. Her, U.S. Patent 6,627,107 (Sept., 2003)

Slurry for chemical mechanical polishing of silicon dioxide: R. Srinivasan, S.V. Babu, W.G. America, and Y-S. Her, U.S. Patent 6,544,892 (April, 2003)

Slurry for chemical mechanical polishing of silicon dioxide: R. Srinivasan, S.V. Babu, W.G. America, and Y-S. Her, U.S. Patent 6,468,910 (Oct. 2002)

Slurry for chemical mechanical polishing of silicon dioxide: R. Srinivasan, S.V. Babu, W.G. America, and Y-S. Her, U.S. Patent 6,491,843 (Dec. 2002)

Electrophotographic apparatus with improved blue sensitivity: S.A. Visser, D.S. Rimai, P.M. Borsenberger, S.V. Babu, U.S. Patent 6,007,954 (Dec. 99)

Method of making multilayer electrophotographic photoconductive elements: S.A. Visser, D.S. Rimai, P.M. Borsenberger, S.V. Babu, 5,849,443 (Dec. 1998).

Multilayer photoconductive elements having low dark decay: S.A. Visser, D.S. Rimai, P.M.Borsenberger, S.V. Babu, U.S. Patent 5,849,445 (Dec. 1998).

Method of making corrosion resistant electrical components: C.V. Srividya and S.V. Babu, U.S. Patent, 5,840,427 (Nov. 1998).

Fuser members with an outermost layer of a fluorinated diamondlike carbon film, S.A. Visser, S.V. Babu, and C.V. Srividya, U.S. Patent 5,674,621 (Oct.1997).

Plasma conditioning of a surface towards electroless plating: G.W. Jones, N.H. Lu and S.V. Babu, U.S. Patent 5,061,359 (Oct. 1991).

Method of plasma etching a substrate with a gaseous organohalide compound: S.V. Babu, J.G. Hoffarth, K. Mack, W. Mlynko, J.F. Rembetski and A. Knoll, U.S. Patent 5,053,104 (Oct. 1991).

Interlaminate adhesion between polymeric materials and electrolytic Cu surfaces: S.V. Babu, V.Q. Bui, J.G. Hoffarth and J.A. Welsh, U.S. Patent 4,810,326.

Removal of residual catalyst from a dielectric substrate: P. Agostino, S.V. Babu, and J. Hoffarth, U.S. Patent 4,735,820 (April 1988).

Method of removing seed particles from circuit board substrate surface: S.V. Babu, W.F. Hermann, J.G. Hoffarth, V. Markovich, R.T. Wiley, U.S. Patent 4,718,972 (1988).

Uniform plasma reactor for drill smear removal: S.V. Babu, R.S. Horwath, Neng-Hsing Lu and J.A. Welsh, U.S. Patent 4,618,477 (Oct. 1986).

Plasma etching with tracer: S.V. Babu, J.G. Hoffarth and J. Welsh, U.S. Patent 4,599,134 (July 1986).

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Dr. S. V. Babu